Cu CMP on AMAG7 Hardmask LineSpace

AMAG is developing Cu/W (copper/tungsten) CMP (chemical mechanical polishing) variants of AMAG7 at NYCreates. These variants will become new standard AMAG7 wafer types. The first round of results are showing enough progress that we are ready to discuss pre-orders.

• Stack: AMAG's Cu/W CMP wafers use our existing AMAG7 Hardmask LineSpace wafer stack (etched oxide line/space on Si substrate with 100nm oxide height), coated with adhesion film then Cu or W dep, and then CMP down to where metal ~50 nm thick on L50P100 anchor target.
• Density gradients and AMAG7: AMAG7 was designed to give a platform for lots of roles all built into one reticle. The entire grating array is one big across-field density DOE. The field includes 547 large pad-size gratings (0.8 mm pad with 0.1 mm moat) spanning CD/pitch/form factor. AMAG7 is designed to be one big CMP experiment, with each grating big enough for uniform un-dished pattern in middle, but dishing will vary condition-to-condition around grating edges. Our strategy is to optimize to anchor target at L50P100 and the rest will perform relative to the optimum. That feature should be best and other patterns should degrade as pitch is increased away from 100 nm, and density thus changes across the field and around various gratings.
  

• Timeline: Our first round of Cu CMP was nominally successful, and with a couple more rounds this new product should be ready for customer use. We expect that development of Cu will be finalized by the end of 2023, and then the first lot can be available for customer orders a month after that. We expect that W will be available about two months behind Cu.